Skip to content

feelbooks.in

FEEL BOOKS

default-logo
Facebook
Menu
  • Home
  • About
  • Shop
  • Catalogues
  • Low Price Editions
  • Special Offers
  • Contact Us
0

Cart

  • View:
  • 12
  • 24
  • All
  • 25% Off
    Encyclopedia of Packaging Materials, Processes, and Mechanics – Set 1: Die-Attach and Wafer Bonding Technology (A 4-Volume Set) Quick View
    • Sale!
      Encyclopedia of Packaging Materials, Processes, and Mechanics – Set 1: Die-Attach and Wafer Bonding Technology (A 4-Volume Set) Quick View
    • Electrical & Electronic Engineering, Engineering / Acoustics

    • Encyclopedia of Packaging Materials, Processes, and Mechanics – Set 1: Die-Attach and Wafer Bonding Technology (A 4-Volume Set)

    • ₹117450.00 Original price was: ₹117450.00.₹88088.00Current price is: ₹88088.00.
    • Add to cart

Active filters

Filter by stock status

Filter by price

Filter by Publisher

Filter by attribute

Subscribe

Get to know more about our latest offers



    • Contact Us
    • About Feel Books
    • Vacancies
    • My Account
    • Cart
    • Privacy Policy
    • Terms & Conditions
    • Shipping & Return
    Copyright 2025 - Feel Books Pvt. Ltd.
    ×
    ×

    Cart